POLYPROPYLENE RESIN COMPOSITION AND POLYPROPYLENE THERMAL ADHESION FILM

A polypropylene resin composition is provided to ensure low thermal adhesion property, printability, moldability, laminate property and transparency. A polypropylene resin composition comprises (A) polypropylene-based resin consisting of a ter-polymer of propylene, ethylene and 1-butene; (B) polyeth...

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Bibliographic Details
Main Authors LEE, KI HYUN, RUY, YOUNG WOO, KANG, GYUNG BO, AHN, JONG IN
Format Patent
LanguageEnglish
Published 10.02.2009
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:A polypropylene resin composition is provided to ensure low thermal adhesion property, printability, moldability, laminate property and transparency. A polypropylene resin composition comprises (A) polypropylene-based resin consisting of a ter-polymer of propylene, ethylene and 1-butene; (B) polyethylene resin 1~8 weight% having the density polymerized under a metallocene catalyst of 0.940-0.965 g/ml; (C) polybuten resin 1~3 weight%; (D) zinc-substituted zeolite-based blocking agent 0.1~0.5 weight%; and (E) silica-based blocking agent 0.1~0.5 weight%.
Bibliography:Application Number: KR20070136526