APPARATUS AND METHOD FOR SINGLE WAFER CLEANING

A single-type wafer cleaning apparatus and a method are provided to prevent re-absorption of pollution particles by performing a cleaning process in a sealed space under ozone atmosphere. A body(10) consists of dome-shaped upper and lower half-bodies, and a wafer mounting unit(60) is installed in th...

Full description

Saved in:
Bibliographic Details
Main Authors CHOI, EUN SUCK, KIM, IN JUNG, LEE, GUN HO, BAE, SO IK
Format Patent
LanguageEnglish
Published 27.06.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A single-type wafer cleaning apparatus and a method are provided to prevent re-absorption of pollution particles by performing a cleaning process in a sealed space under ozone atmosphere. A body(10) consists of dome-shaped upper and lower half-bodies, and a wafer mounting unit(60) is installed in the body to mount and rotate the wafer in the body. An ozone gas line(21) supplies an ozone gas in the body, and a nitrogen/inert gas line(40) supplies a nitrogen gas and an inert gas in the body. Plural gas spraying nozzles(20) are provided on upper and lower round surfaces of the body, and are selectively supplied with the ozone gas, the nitrogen gas and the inert gas. A cleaning solution spraying nozzle(50) sprays a cleaning solution onto the surface of the wafer, and a vacuum pump(70) drains the gas from the body. The body has an outer body(11) and an inner body(12), in which a gas layer(13) is formed between the outer body and the inner body.
Bibliography:Application Number: KR20060134753