TAPE CIRCUIT SUBSTRATE HAVING CONNECTED TEST WIRING AND METHOD FOR EXAMINING THEREOF

• Main Authors: YOON, SUK BUM, JEON, JE SEOG, LEE, SUNG SOO, CHUNG, CHAN SIK
• Format: Patent
• Language: English
• Published: 14.12.2007
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A tape circuit substrate having a test wiring and a method for examining the same are provided to reduce an occupied area of IC patterns by reducing the number of test pads. A base film(10) includes a chip mounting part on which a semiconductor chip is mounted. The base film is formed with an insula...