TAPE CIRCUIT SUBSTRATE HAVING CONNECTED TEST WIRING AND METHOD FOR EXAMINING THEREOF

A tape circuit substrate having a test wiring and a method for examining the same are provided to reduce an occupied area of IC patterns by reducing the number of test pads. A base film(10) includes a chip mounting part on which a semiconductor chip is mounted. The base film is formed with an insula...

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Bibliographic Details
Main Authors YOON, SUK BUM, JEON, JE SEOG, LEE, SUNG SOO, CHUNG, CHAN SIK
Format Patent
LanguageEnglish
Published 14.12.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A tape circuit substrate having a test wiring and a method for examining the same are provided to reduce an occupied area of IC patterns by reducing the number of test pads. A base film(10) includes a chip mounting part on which a semiconductor chip is mounted. The base film is formed with an insulating material. A plurality of bypass wirings(20) are formed on the base film in order to bypass the chip mounting part. A plurality of test wirings(30) are formed on the base film in order to be connected to the bypass wirings. The first test wiring and the second test wiring of the test wirings are connected to each other. The third test wiring is formed between the first test wiring and the second test wiring on the base film.
Bibliography:Application Number: KR20060133182