A OPTICAL DEVICE USING STACKED PASSIVE ELEMENTS

An optical device package using a stacked passive element is provided to improve the usage convenience of a complicated driving chip and to reduce a wire bonding by maximizing utilization of island space and simplifying a structure on a lead frame. A lead frame type optical device is comprised of an...

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Bibliographic Details
Main Authors CHUNG, YOUNG MIN, KANG, CHOUL JUN
Format Patent
LanguageEnglish
Published 03.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An optical device package using a stacked passive element is provided to improve the usage convenience of a complicated driving chip and to reduce a wire bonding by maximizing utilization of island space and simplifying a structure on a lead frame. A lead frame type optical device is comprised of an optical device(11) mounted on a lead frame(21), a driving chip(12) for driving the optical device, and a stacked passive element(13). The stacked passive element is an LTCC(Low Temperature Co-fired Ceramic) passive element. The stacked passive element is a capacitor, a resistor, an inductor, or a combination thereof. The LTCC passive element is directly connected to the driving chip.
Bibliography:Application Number: KR20060083556