SUBSTRATELESS FLIP CHIP PACKAGE AND FABRICATING METHOD THEREOF

A substrateless flip chip package and a manufacturing method thereof are provided to eliminate a signal transmission obstructing factor to be formed between an integrated circuit and a printed circuit board. Plural bond pads(7) are formed on a semiconductor die(1), and the semiconductor die is seale...

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Bibliographic Details
Main Authors JEONG, JIN WOOK, KIM, KI BUM, RYU, KI TAE, YOO, HYUN OH
Format Patent
LanguageEnglish
Published 03.07.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrateless flip chip package and a manufacturing method thereof are provided to eliminate a signal transmission obstructing factor to be formed between an integrated circuit and a printed circuit board. Plural bond pads(7) are formed on a semiconductor die(1), and the semiconductor die is sealed by a sealant(3). A wire terminal is extended from the bond pad, and is drawn outwardly from the sealant. A heat radiation layer is attached to one side of the semiconductor die, and an adhesive layer is interposed between the semiconductor die and the heat radiation layer. The bond pad is formed on a first flat surface of the semiconductor die, and the heat radiation layer is formed on a second flat surface.
Bibliography:Application Number: KR20060058211