COMPOSITION FOR PRODUCING OF DICING DIE ADHESIVE FILM

A composition for producing dicing die adhesive film is provided to minimize formation of voids, to have good moisture resistance, and to ensure reliance of a semiconductor packaging process. The composition for producing dicing die adhesive film comprises 15-28wt% of rubber having a molecular weigh...

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Bibliographic Details
Main Authors SUNG, TAE HYUN, KANG, BYUNG UN, SUH, JOON MO, KIM, JAE HUN, WI, KYOUNG TAE
Format Patent
LanguageEnglish
Published 24.01.2007
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:A composition for producing dicing die adhesive film is provided to minimize formation of voids, to have good moisture resistance, and to ensure reliance of a semiconductor packaging process. The composition for producing dicing die adhesive film comprises 15-28wt% of rubber having a molecular weight of 50,000 or more, 10-20wt% of rubber having modified terminals, 10-30wt% of a crystalline epoxy material having a melt viscosity at 150‹C of 0.5 Poise or below, and 22-65wt% of a general-purpose epoxy material. The rubber having a molecular weight of 50,000 or more is any one selected from acrylonitrilebutadiene rubber, glycidylacrylate rubber, and styrenebutadiene rubber, or a combination thereof.
Bibliography:Application Number: KR20060007841