PRINTED CIRCUIT BOARD AND THE METHOD THEREOF

A PCB and a manufacturing method thereof are provided to increase a density of IVHs(Inner Via Holes) formed on the core unit by using a thin glass substrate as a core unit. A PCB(Printed Circuit Board) includes a core unit, a first plating layer(20), and a second plating layer(22). The core unit inc...

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Bibliographic Details
Main Author CHO, SOON JIN
Format Patent
LanguageEnglish
Published 16.11.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A PCB and a manufacturing method thereof are provided to increase a density of IVHs(Inner Via Holes) formed on the core unit by using a thin glass substrate as a core unit. A PCB(Printed Circuit Board) includes a core unit, a first plating layer(20), and a second plating layer(22). The core unit includes a glass substrate, on which a via-hole is formed. The first plating layer is formed on a surface of the core unit corresponding to a circuit pattern. The second plating layer is formed on a region, where the first plating layer is formed. A thickness of the glass substrate lies between 0.1 and 0.3mm. The via-hole is filled with a conductive paste, plug-in ink, or the second plating layer.
Bibliography:Application Number: KR20050085607