METHOD OF PREPARING A METAL BUMP FOR BUILDING A PACKAGE SUBSTRATE ON PRINTED CIRCUIT BOARD

A method of preparing a metal bump for building a package substrate on a printed circuit board is provided to simplify a process for mounting components by directly forming a metal bump on an outer surface of a printed circuit board. A copper plating layer is formed on an entire surface of a printed...

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Bibliographic Details
Main Authors YOON, SANG KOWN, LEE, HAN JIN
Format Patent
LanguageEnglish
Published 02.11.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method of preparing a metal bump for building a package substrate on a printed circuit board is provided to simplify a process for mounting components by directly forming a metal bump on an outer surface of a printed circuit board. A copper plating layer is formed on an entire surface of a printed circuit board(100). A photoresist pattern is formed on the entire surface of the printed circuit board by coating a photoresist on the entire surface of the printed circuit board and removing selectively the photoresist. A multi-layered metal bump(105) is formed by performing a plating process. The metal bump is projected from an outer surface of the printed circuit board by removing the photoresist and the exposed copper plating layer. A package substrate is attached on the metal bump.
Bibliography:Application Number: KR20050045277