METHOD FOR FABRICATING GATE ELECTRODE USING ANTI-REFLECTIVE LAYER AND METHOD FOR FORMING SELF-ALIGNED CONTACT USING THE SAME
PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided to form a gate electrode having a sufficient insulating margin between an electrode and a contact by using an anti-reflective layer. CONSTITUT...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
15.01.2001
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided to form a gate electrode having a sufficient insulating margin between an electrode and a contact by using an anti-reflective layer. CONSTITUTION: A doped polysilicon layer and a metallic silicide layer are formed on a semiconductor substrate(10). A capping layer is formed on the metallic silicide layer. An anti-reflective layer is formed on the capping layer. A protective layer is formed on the anti-reflective layer. The protective layer, the anti-protective layer and the capping layer are etched by performing a photo-lithography process. A mask pattern(38) including a capping layer pattern(32a), an anti-respective layer pattern(34a) and a protective layer pattern(36a) is formed by etching the protective layer, the anti-protective layer, and the capping layer. A gate electrode(26) is formed by etching the metallic silicide layer and the doped polysilicon layer. |
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AbstractList | PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided to form a gate electrode having a sufficient insulating margin between an electrode and a contact by using an anti-reflective layer. CONSTITUTION: A doped polysilicon layer and a metallic silicide layer are formed on a semiconductor substrate(10). A capping layer is formed on the metallic silicide layer. An anti-reflective layer is formed on the capping layer. A protective layer is formed on the anti-reflective layer. The protective layer, the anti-protective layer and the capping layer are etched by performing a photo-lithography process. A mask pattern(38) including a capping layer pattern(32a), an anti-respective layer pattern(34a) and a protective layer pattern(36a) is formed by etching the protective layer, the anti-protective layer, and the capping layer. A gate electrode(26) is formed by etching the metallic silicide layer and the doped polysilicon layer. |
Author | SHIN, GYEONG SEOP JUNG, SANG SEOP LEE, WON SEOK |
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Snippet | PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | METHOD FOR FABRICATING GATE ELECTRODE USING ANTI-REFLECTIVE LAYER AND METHOD FOR FORMING SELF-ALIGNED CONTACT USING THE SAME |
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