METHOD FOR FABRICATING GATE ELECTRODE USING ANTI-REFLECTIVE LAYER AND METHOD FOR FORMING SELF-ALIGNED CONTACT USING THE SAME

PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided to form a gate electrode having a sufficient insulating margin between an electrode and a contact by using an anti-reflective layer. CONSTITUT...

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Bibliographic Details
Main Authors SHIN, GYEONG SEOP, LEE, WON SEOK, JUNG, SANG SEOP
Format Patent
LanguageEnglish
Korean
Published 15.01.2001
Edition7
Subjects
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Summary:PURPOSE: A method for fabricating a gate electrode using an anti-reflective layer and a method for forming a self-aligned contact using the same are provided to form a gate electrode having a sufficient insulating margin between an electrode and a contact by using an anti-reflective layer. CONSTITUTION: A doped polysilicon layer and a metallic silicide layer are formed on a semiconductor substrate(10). A capping layer is formed on the metallic silicide layer. An anti-reflective layer is formed on the capping layer. A protective layer is formed on the anti-reflective layer. The protective layer, the anti-protective layer and the capping layer are etched by performing a photo-lithography process. A mask pattern(38) including a capping layer pattern(32a), an anti-respective layer pattern(34a) and a protective layer pattern(36a) is formed by etching the protective layer, the anti-protective layer, and the capping layer. A gate electrode(26) is formed by etching the metallic silicide layer and the doped polysilicon layer.
Bibliography:Application Number: KR19980018828