ADHESIVE ADHESIVE FILM AND ADHESIVE-BACKED METAL FOIL

• Main Authors: YAMAMOTO, KAZUNORI, SHIMADA, YASUSHI, KUMASHIRO, YASUSHI, INADA, TEIICHI
• Format: Patent
• Language: English; Korean
• Published: 15.12.1999
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

본 발명은 (1) 중량 평균 분자량이 5,000 이하인 에폭시 수지와 경화제의 조합체 100 중량부, (2) 에폭시 수지와 상용성이며 중량 평균 분자량이 30,000 이상인 고분자량 성분 10 내지 40 중량부, (3) 에폭시 수지와 비상용성이며 중량 평균 분자량이 30,000 이상인 고분자량 성분 20 내지 100 중량부, 및 (4) 경화 촉진제 0.1 내지 5 중량부를 포함하는 접착제에 관한 것으로서, 상기 접착제는 내습성, 내열성, 고온 접착 강도, 방열성, 절연 신뢰성, 내균열성 및 유연성이 우수할 뿐만 아니라, 회로 충진성과 밀착성이 뛰어나며, 또한 적합한 유동성을 나타낸다. An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.