SEMICONDUCTOR DEVICE

• Main Author: KITAOKA, KOKI
• Format: Patent
• Language: English
• Published: 01.12.1999
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor apparatus includes a semiconductor chip having an upper surface, a lower surface and at least one side surface; a first radiator plate for radiating heat including a plate portion having an upper surface, a lower surface and at least one side surface and a body portion having an upper surface, a lower surface and at least one side surface. The upper surface of the body portion has an area smaller than an area of the lower surface of the plate portion and is connected with the lower surface of the plate portion. The semiconductor apparatus also includes a second radiator plate for radiating heat including an upper surface, a lower surface and at least one side surface. The upper surface of the second radiator plate has an area larger than the lower surface of the body portion of the first radiator plate. The apparatus still further includes a case body surrounding the lower surface and the side surface of the semiconductor chip and a cover which is located above the upper surface of the semiconductor chip and is connected with the case body. This structure provides a semiconductor apparatus incorporating a semiconductor device mounted in a hollow plastic package having a radiator system, without deteriorating the mechanical strength and the moisture resistance of the package.\!