SEMICONDUCTOR CHIP PACKAGING

• Main Authors: ASAMI, YUKIO, KOJIMA, AKIRA, FUKASAWA, HIROYUKI
• Format: Patent
• Language: English; Korean
• Published: 01.10.1999
• Edition: 6
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

다이패드가 없는 리드프레임 내에 반도체 칩을 위치시켜 반도체 디바이스가 제조된다. 칩의 전극은 결합와이어에 의해 각 리드핑거에 연결된다. 또한 리드프레임은 칩을 둘러싸는 몰드안으로 수지 주입시에 리드프레임내의 칩의 수평이동을 제한하는 이동제한 핑거부를 가진다. 또한 몰드는 몰드 캐비터내의 칩의 수직이동을 제한하도록 수평 이동 제한 돌출부를 가진다. 칩의 수평 및 수직 이동의 제한은 수지 주입 공정시에 결합와이어의 파괴 또는 단락의 위험성을 감축한다. A semiconductor device is fabricated by placing a semiconductor chip (7) in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers (3). Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mould surrounding the chip. Furthermore, the mould has horizontal movement restricting projections (12) to limit vertical movement of the chip within the mould cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.