WET ETCHING METHOD AND COMPOSITION

• Main Authors: FJARE, DOUGLAS E, NAVAR. CYNTHIA A, BEUHLER, ALLYSON J
• Format: Patent
• Language: English; Korean
• Published: 15.06.1999
• Edition: 6
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; GENERAL PROCESSES OF COMPOUNDING; HOLOGRAPHY; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

본 발명은 치환된 탄화수소 용매와, 폴리암산 또는 부분적으로 경화된 폴리암산을 탈양성자화시키기에 충분할 정도로 강한 비이온성 염기를 0.1 내지 49:49 내지 0.1의 중량비로 함유하고, 이온성 염기를 1.0% 미만으로 함유하며, 물이 대부분을 구성하는 수용액을 포함하는, 폴리암산 또는 부분적으로 경화된 폴리암산을 에칭시키기 위한 습식 에칭 조성물 및 습식 에칭 방법에 관한 것이다. A wet-etch composition for polyamic acids and partially cured polyamic acids comprising an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.