COMPOSITE ARTICLE COMPRISING A COPPER ELEMENT AND A PROCESS FOR PRODUCING IT

• Main Authors: KOGAWA, KIYONORI, TAKAHASHI, AKIO, MURAKAMI, KANJI, SUZUKI, YOSHIHIRO, NAGAI, AKIRA, AKAHOSHI, HARUO
• Format: Patent
• Language: English
• Published: 15.12.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

To make a composite article comprising a copper element (12) and an adhesive material (6) adhesively bonded to a surface thereof, the surface of the copper element is provided with a microstructure comprising knife-shaped elongate projections (14) whose opposite flanks are at an average angle of less than 60 DEG to each other. The microstructure may include rod-shaped projections much smaller than said knife-shaped projections projecting outwardly from the surface of said knife-shaped projections. The knife-shaped projections may be formed by electroless plating and the rod-shaped projections by oxidation and optionally reduction. Bonding strength is improved.