PROCESS FOR PURIFICATION OF GASEOUS ORGANOMETALLIC COMPOUND

• Main Authors: IWATA, KEIICHI, YASUDA, MASAKO, SHIMADA, TAKASHI
• Format: Patent
• Language: English; Korean
• Published: 15.10.1998
• Edition: 6
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; ORGANIC CHEMISTRY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEPARATION; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

불순물을 함유하는 기체상 유기금속화합물을, 동 또는 니켈을 주성분으로 하는 촉매와 접촉시켜, 이 유기금속 화합물중에 불순물로 함유되는 산소를 제거함으로써, 기체상 유기금속 화합물을 정제하는 방법이 개시되어 있다. 이 방법에 따라, 종래 제거가 곤란했던 유기금속 화합물중의 산소를 0.1ppm이하, 또한 0.01ppm이하가 되는 극저농도까지 제거할 수 있고, 초고순도의 유기금속 화합물을 얻는 것이 가능하다. There is disclosed a process for purification a gaseous organometallic compound containing impurities by bringing the compound into contact with a catalyst comprising a copper or nickel component as the essential ingredient to remove oxygen contained in the compound. The above-mentioned process is capable of removal of oxygen in an organometallic compound as low as 0.1 ppm and further to a ultralow concentration of 0.01 ppm, which removal has heretofore been impossible, and thereby the production of a ultrapure organometallic compound has been made possible.