AN APPARATUS FOR REMOVING FOREIGN PARTICLES AND THE METHOD

• Main Authors: SASAKI, SHINJI, OHARA, KAZUHIRO, OTSUBO, TORU, SUZUKI, YASUMICHI, SASAKI, ICHIROU
• Format: Patent
• Language: English; Korean
• Published: 15.07.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

본 발명의 목적은 드라이에칭과 스퍼터등의 드라이 프로세스처리전에 진공중과 드라인한 분위기중에서 이물을 제거하여, 드라이 프로세스와 연속해서 처리할 수 있는 이물제거방법 및 장치를 제공하는 것이다. 본 발명을 기판에서 이물을 떼어내는 힘을 가함과 동시에 이물을 진동시키는 힘을 인가하여, 그 진동주파수를 변화시켜서 이물과 기판사이에서 형성되는 진동계의 공진주파수와 맞추어서, 공명에 의해 이물에 진동에너지를 주어, 이물을 기판에서 이탈시킨다. 이 이탈되어 플라즈마내에서 부유하는 이물을 전자의 유입을 저감시키도록 전위를 제어한 전극으로 흡인시켜 플라즈마내에서 제거한다. 본 발명에 의해 이물의 저감이 되고, 반도체와 TFT제조에서 제품수율 향상이 도모된다. 또 세정공정과 성막, 에칭등을 연속해서 처리할 수 있어, 공정소멸, 생산성 향상이 도모된다. A method of and apparatus removes foreign particles in a vacuum or in a dry atmosphere before and in continuation to performing a dry process, such as a dry etching or a sputtering process. For this purpose, the foreign particles are separated from a substrate by subjecting the foreign particles to a force for separating the foreign particles from the substrate and a vibrating force for vibrating the foreign particles at the same time, and then the frequency of vibration is changed to match the resonant frequency of a vibration system formed by each of the foreign particles and the substrate, thereby applying a vibration energy to the foreign particles due to resonance. The separated foreign particles floating in a plasma are drawn to an electrode having a potential which is controlled such that a flowing-in of electrons is reduced, and the particles are discharged from the inside of the plasma. In this way, the foreign particles can be reduced and the yield of the product in manufacturing semiconductors and TFTs can be promoted. Further, a cleaning step, a film forming operation, an etching process and the like can continuously be processed, thereby achieving a reduction in steps and a promotion in productivity.