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Summary:없음 The present invention relates to hot-melt adhesive coating solutions which contain A) from 5 to 80% by weight of a copolyamide built up from units derived from A1) organic dicarboxylic acids where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms, and A2) a mixture of diisocyanates comprising a21) from 20 to 95 mol% of a diisocyanate of the formula OCN-R -NCO where R is an aromatic radical having 5 to 25 carbon atoms, a22) from 5 to 70 mol% of a diisocyanate of the formula OCN-R -NCO where R is or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom, a23) from 0 to 20 mol% of a diisocyanate of the formula OCN-(CH2)y-NCO where y is an integer in the range from 1 to 20, and B) from <0.5 to 30% by weight of a blocked diisocyanate or polyisocyanate, in an organic solvent or solvent mixture.
Bibliography:Application Number: KR19900007595