MELT-ADHESIVE COATING SOLUTION FOR HEAT-RESISTANT COATINGS
없음 The present invention relates to hot-melt adhesive coating solutions which contain A) from 5 to 80% by weight of a copolyamide built up from units derived from A1) organic dicarboxylic acids where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 2...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
28.04.1998
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | 없음
The present invention relates to hot-melt adhesive coating solutions which contain
A) from 5 to 80% by weight of a copolyamide built up from units derived from
A1) organic dicarboxylic acids
where R is an aliphatic radical having from 1 to 20 carbon atoms or an aromatic radical having from 5 to 25 carbon atoms,
and
A2) a mixture of diisocyanates comprising
a21) from 20 to 95 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is an aromatic radical having 5 to 25 carbon atoms,
a22) from 5 to 70 mol% of a diisocyanate of the formula
OCN-R -NCO
where R is
or a linear aliphatic radical having 3 to 30 carbon atoms which is substituted by 1 to 3 C1-C4-alkyl groups, and R and R , independently of one another, are each a C1-C4-alkyl group or a hydrogen atom,
a23) from 0 to 20 mol% of a diisocyanate of the formula
OCN-(CH2)y-NCO
where y is an integer in the range from 1 to 20,
and
B) from <0.5 to 30% by weight of a blocked diisocyanate or polyisocyanate,
in an organic solvent or solvent mixture. |
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Bibliography: | Application Number: KR19900007595 |