プリント配線用基板、プリント配線板およびこれらの製造方法

• Format: Patent
• Language: Japanese
• Published: 06.10.2005
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

例えばスクリーン印刷法などの通常の印刷法によって微細な、しかも境界線が明りょうで良好な導体配線を形成することができる新規なプリント配線用基板と、それを用いたプリント配線板、およびこれらを製造するための製造方法を提供する。プリント配線用基板とその製造方法は、基板の表面に（１）粗面化処理、（２）プラズマ処理、（３）粗面化処理をしたのちプラズマ処理、または（４）粗面化処理をしたのち、スパッタリング法による金属膜の被覆形成処理のうちいずれか１つの表面処理を施すことを特徴とし、プリント配線板とその製造方法は、上記表面に、平均粒径４μｍ以下、最大粒径１５μｍ以下の金属粒子を含む導電ペーストを用いて印刷法によって導体配線を形成することを特徴とし、他のプリント配線板とその製造方法は、上記表面に、金属粒子ＭとバインダーＢとを体積比Ｍ／Ｂ＝１／１〜１．９／１の割合で含む導電ペーストを用いて形成した導体配線の表面をエッチング後、めっき被膜を積層、形成することを特徴とする。 A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 mu m or less and the maximum particle diameter of which is 15 mu m or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.