METHOD FOR SUPPLYING AND COMPRESSING SOLDER

PURPOSE:To improve accuracy and reliability in bonding, by supplying solder to a base assembling part of a lead frame and the like, cutting a required minute amount of the solder with a knife edge, and compressing the solder with a compressing tool at the same time. CONSTITUTION:With a solder 7 bein...

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Bibliographic Details
Main Authors OKAMURA KOICHIRO, ICHIMURA HIDEO
Format Patent
LanguageEnglish
Published 12.01.1989
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To improve accuracy and reliability in bonding, by supplying solder to a base assembling part of a lead frame and the like, cutting a required minute amount of the solder with a knife edge, and compressing the solder with a compressing tool at the same time. CONSTITUTION:With a solder 7 being kept with a clamper 8, the clamper 8 advances. When the minute amount of the solder 7 is pushed out, a knife edge 3, a compressing tool 5, the clamper 8 and the solder 7 are simultaneously lowered, and the solder 7 is cut. Then, the compressing tool is lowered, and the cut solder is compressed to a lead frame 12. The clamper 8 releases the solder 7. The clamper 8 is retreated by the supplied length of the solder. The clamper 8 holds the solder 7 again and 15 further retreated. The solder 7 is separated, and cutting is ensured. Thereafter, the compressing with the compressing tool 5 is completed. Ultrasonic waves are applied to the knife edge 3 and the compressing tool 5. Thus the cutting of the solder at a low temperature is performed.
Bibliography:Application Number: JP19870164430