MOLDING DEVICE

• Main Authors: ENOMOTO USUKE, SAKAMOTO TOMOO
• Format: Patent
• Language: English
• Published: 15.03.1989
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To improve utility of a molding material by keeping a quality of a product, by a method wherein a plurality of cavities are juxtaposed in series on a molding tool, the molding material is cast into each cavity in and after a second stage through a connecting path to be connected with the preceeding cavity and any of the cavities is made a sacrificed cavity. CONSTITUTION:A multi-linked lead frame 1 is positioned on a mating face of a bottom force 12 so that a pellet and bonding wire on a unit lead frame of a sealing object are held within each cavity recessed part 13b, a top force 11 and the bottom force 12 are clamped down and each cavity 13 is formed. Resin 20 cast into the first stage cavity 13 is kept filling within the cavity along the center line and the resin 20 which has arrived at a connecting path 18 is cast into the second stage cavity 13 through its gate 17. The cast resin 20 is kept filling similary along the center line. On and after that, the resin is kept filling by flowing in order similarly up to the final stage cavity 19. The final stage cavity 19 is abolition-treated as the sacrificed cavity 19.