MANUFACTURE OF SUBSTRATE WITH THIN FILM WIRING

• Main Authors: YUKI MASAKI, SUEKANE MICHINOBU
• Format: Patent
• Language: English
• Published: 08.03.1989
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To eliminate dissolution of a first wiring material and to obviate the defect of a resist residue by laminating a layer of a second wiring material which is scarcely dissolved in a resist release agent as compared with the first wiring material on the layer of the first wiring material soluble in the resist release agent formed on a substrate. CONSTITUTION:A layer 2 of a first wiring material soluble in resist release agent is formed on a substrate 1, a layer 3 of a second wiring material which is scarcely dissolved as compared with the first wiring material is laminated thereon, and a resist 4 is formed in a desired pattern by a photolithography method. The layers 3, 2 of the materials are sequentially etched. The remaining resist 4 is removed by the agent to obtain a multilayer interconnection. Then, the layer 2 of the material is protected by the layer 3 of the material, the layer 2 is not dissolved to eliminate the defect of the resist residue.