SOLUBLE AND HEAT-RESISTANT COPOLYAMIDE

• Main Authors: INOUE HIROHARU, TERAMOTO TAKEO, HARADA KAZUAKI
• Format: Patent
• Language: English
• Published: 30.04.1988
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To obtain the titled copolymer, having a specific structure derived from a phthalic acid derivative and bis(aminophenyl)fluorenes and a diamine and having excellent solubility, high heat resistance, good thermal moldability, mechanical as well as electrical characteristics, etc. CONSTITUTION:A copolymer having a structure expressed by formula I [X is formula II; Y consists of a chain member expressed by formula III (R is H, CH3 or C2H5) and the formula -CnH2n-(n is 2-8)] and >=0.25dl/g intrinsic viscosity (etainh) measured by using a solution in 0.5g/100ml concentration in dimethylacetamide as a solvent as 30 deg.C. As raw materials for the above- mentioned copolymer, terephthaloyl chloride is preferred as a raw material for the component expressed by formula II and 1,3-propylenediamine is preferred as a raw material for the component expressed by the formula -CnH2n-. For example, 9,9-bis(4-aminophenyl)fluorene, etc., are used as the raw material for the component expressed by formula III. The above-mentioned copolymer is preferably obtained by polymerizing such raw materials in a solvent while cooling.