SPUTTERING DEVICE

• Main Author: SHINOHARA JOSHI
• Format: Patent
• Language: English
• Published: 25.04.1988
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To provide a titled device which can form a film uniformly over the entire inside peripheral face of a pipe material even if said material is long-sized, by sticking the metal ions evaporating from a metallic vapor source which is a raw material to the inside surface of the pipe material while moving a plating gun from one end of the pipe material the inside of which is evacuated to a vacuum to the other end. CONSTITUTION:After the inside of the pipe material 1 to be plated is evacuated to a vacuum through an aperture 3a of a sealing material 3, a gaseous mixture composed of a reactive gas and ionizing gas is supplied into the pipe material 1. An electrode 11 is then energized to ionize the reactive gas released from spacings 20, 21 and metal vapor is released from the point of the raw material metal 9 surface where the discharge is generated. The thermions and reactive gas by the discharge are bombarded against the metal vapor to drive electrons off the metal atoms by which a film 19 bonded with both ions is formed on the inside peripheral face of the pipe material 1. The film 19 is formed uniformly over the entire peripheral surface in the axial direction of the pipe material 1 if the plating gun 5 and a heating source 18 are moved during this time.