SPUTTERING DEVICE

• Main Author: SHINOHARA JOSHI
• Format: Patent
• Language: English
• Published: 25.04.1988
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To form a film in a pipe material to be sputtered without using a large-capacity vacuum vessel even if said material is long-sized, by inserting a sputtering gun slidably in a hermetic state into one sealing material which is freely evacuatable to a vacuum and moving the gun in an axial direction. CONSTITUTION:The air in the pipe material 1 to be sputtered is sucked through an aperture 3a of the sealing material 3 to evacuate the inside of the pipe to a vacuum. While a gaseous mixture composed of a reactive gas and sputtering gas is supplied into the pipe material 3, a high-frequency voltage is impressed to a target electrode 4. Discharge plasma is thereby generated between the electrode 4 and the pipe material 1 and the sputtering gas is ionized by the generated plasma. The gaseous ions are bombarded against the electrode 4 and the target atoms driven off the electrode are stuck to the inside peripheral face of the pipe material 1 to execute sputter coating or reactive sputter coating by bonding to the reactive gas, by which the film 19 is formed in the pipe material. The sputtering gun is moved in succession thereto so that the film 19 is uniformly formed axially on the inside peripheral face of the pipe material 1.