SEMICONDUCTOR EXPOSURE DEVICE
PURPOSE:To produce a test wafer for measuring distortion in a projection optical system, by changing the printing range and the wafer shifting mode for a single pattern according to stored information of a group of parameters. CONSTITUTION:A semiconductor exposure unit according to the present inven...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
30.03.1988
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To produce a test wafer for measuring distortion in a projection optical system, by changing the printing range and the wafer shifting mode for a single pattern according to stored information of a group of parameters. CONSTITUTION:A semiconductor exposure unit according to the present invention comprises an illumination device 1, a masking blade 2 for controlling the amplitude of an illuminated range, a reticle stage 3 for carrying a reticle 4 having a circuit pattern 5, an imaging lens 6 serving as a projection optical system for printing the pattern, an X-Y stage 7 for carrying a wafer 8 on which the circuit pattern is to be printed and for shifting the wafer along the X-and Y-directions in the printing plane, a pulse motor 9 for driving the masking blade, a pulse motor 10 for driving the X-Y stage, a control box 11 in which a control unit such as CPU and a storage device are received and a console consisting of a monitor display 12 and a keyboard 13. Such exposure unit can change the mode of moving the wafer as well as the range of exposure in a single wafer manufacturing process. Thus, it is possible to produce a test wafer for measuring distortion in the projection optical system of the subject device. |
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Bibliography: | Application Number: JP19860212748 |