THIN FILM FORMING DEVICE

• Main Author: MORI EISAKU
• Format: Patent
• Language: English
• Published: 23.02.1988
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To prevent the fall of the deposits on an electrode for improving potential distribution into and onto a crucible and filament with a thin film forming device by providing said electrode inserted between grids and the crucible so as to crown and incline. CONSTITUTION:A material 2 for vapor deposition in the crucible 1 is heated to form vapor 4 which is ejected from a nozzle 3 into a vacuum so as to collide against the ionized electrons drawn out to the grids 9 and to form the ions of positive charge. The vapor 4 formed as the positive ion is accelerated by an acceleration electrode 13 and is deposited by evaporation on a substrate 14 by which a vapor deposited film 15 is formed. The electrode 21A for improving the potential distribution inserted between the grids 9 and the crucible 1 of the device which makes the above-mentioned operation is provided to crown and incline. The materials flow to the peripheral part of a lower level and are thus prevented from falling into the crucible 1 and onto the filament 5 even if the vapor sticks and deposits on the electrode 21a. The staining of the device is thereby prevented without generating electric discharge between the crucible 1 and the filament 5.