METALLIC BASE BOARD

• Main Authors: KATSUO RYUJI, OKAWA KOJI, YOSHIOKA MICHIHIKO
• Format: Patent
• Language: English
• Published: 08.11.1988
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING

PURPOSE:To prevent a board layer and insulating layer from peeling off between them even if they are heated at a high-temperature, by a method wherein the title board possesses a chromium layer having a black rough surface on a thermally conductive metallic board, an insulating organic high-molecular weight layer is formed on the black rough surface and a conductive metallic foil is laminated on the insulating organic high-molecular weight layer. CONSTITUTION:The title board possesses a chromium plated layer 2 having a black rough surface 21 on a thermally conductive metallic board 1 and an insulating organic high-mol. wt. layer 3 is formed on the black rough surface 21 of the chromium plated layer 2. A conductive metallic foil 4 is laminated on the insulating organic high-mol. wt. layer 3 further. The insulating organic high-mol. wt. layer 3 and a polyimide film are stuck onto the black rough surface 21 of the chromium plated layer 2 respectively with the polyimide film and an adhesive agent 5. The chromium plated black rough surface 21 shows favorable adhesion to the normal adhesive agent at not only normal temperature but also at a high temperature to be heated in a soldering process. Therefore, it does not happen that peeling is generated between the thermally conductive metallic board and insulating layer even if they are heated.