FIELD-EFFECT TRANSISTOR
PURPOSE:To increase the channel current at the same gate bias voltage as in a conventional design by a method wherein an impurity-containing semiconductor layer is provided between an impurity-free semiconductor layer and gate insulating layer. CONSTITUTION:In a field effect transistor of this desig...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
25.10.1988
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To increase the channel current at the same gate bias voltage as in a conventional design by a method wherein an impurity-containing semiconductor layer is provided between an impurity-free semiconductor layer and gate insulating layer. CONSTITUTION:In a field effect transistor of this design, a gate electrode 105, a gate insulating layer 104 in contact with the gate electrode 105, an impurity- containing first semiconductor layer 107 in contact with the gate insulator 104, an impurity-free second semiconductor layer 103, and a source electrode 102 and a drain electrode 101 which are in ohmic contact with the second semiconductor layer 103 and are separated from each other with a gate electrode 105 at the middle. For example, chromium is spattered onto a glass substrate 106 for the patterning of a gate electrode 105. Next, a gate insulating layer 104 is formed, whereon an N<+>-a-Si active layer 107, an j-a-Si layer 103, and an n<+>-a-Si layer 108 are formed, in that order. Further, chromium is applied in a second spattering process, and then patterning is accomplished for a drain electrode 101 and a source electrode 102. |
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Bibliography: | Application Number: JP19870093659 |