ALUMINUM ALLOY FOR BONDING WIRE

PURPOSE:To obtain an Al alloy for bonding wire having superior ball-forming property, capable of connection by ball bonding, and improved in bonding strength and in corrosion resistance, by specifying a composition consisting of Mg, Sb and Al. CONSTITUTION:The Al alloy for bonding wire has a composi...

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Bibliographic Details
Main Authors NISHIO MASANOBU, SAWADA KAZUO, KISHIDA HITOSHI
Format Patent
LanguageEnglish
Published 28.04.1987
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:PURPOSE:To obtain an Al alloy for bonding wire having superior ball-forming property, capable of connection by ball bonding, and improved in bonding strength and in corrosion resistance, by specifying a composition consisting of Mg, Sb and Al. CONSTITUTION:The Al alloy for bonding wire has a composition consisting of, by weight, 0.8-1.7% Mg. 0.001-0.1% Sb and the balance essentially Al and further containing, if necessary, up to 0.3% of one or more elements among Zr, Ti, Cr, V, Cu and B and/or <=1.5% Si. In the above alloy, wire strength is increased and formation of Al oxide film is inhibited in ball formation so as to form superior balls and to improve bonding strength.
Bibliography:Application Number: JP19850234360