THIN-WALL MATERIAL FOR METALLIC SURFACE PROTECTION

• Main Authors: MAEDA MASAHIKO, SAITOU YASUAKI, WATANABE NAOTOSHI, NAGATA KAZUYA
• Format: Patent
• Language: English
• Published: 27.04.1987
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PURPOSE:To obtain a thin-wall material for metallic surface protection, which is excellent in adhesion and resistance to heat and solvents and has flexibility capable of following processing, by using a thin-wall material composed of a crosslinked mixture of two specified ethylene copolymers as a protective material. CONSTITUTION:A thin-wall material for metallic surface protection is composed of the following thin-wall material as a material for protecting the surface of a metallic molding of 5mu-3mm in thickness. Said thin-wall material is one composed of a crosslinked mixture of 1-99wt% ethylene copolymer (A) having as ethylene unit content of 30-89.5wt%, composed of an ethylene unit and a unit selected from among carboxylic acid, dicarboxylic acid, their anhydride and half ester units and 99-1wt% ethylene copolymer (B) having an ethylene unit content of 30-99.5wt%, composed of an ethylene unit and a unit selected from among hydroxyl, amino and glycidyl units.