ANTICORROSIVE TREATMENT OF COPPER AND COPPER ALLOY

• Main Authors: WATANABE ISAO, NATORI KATSUHIDE
• Format: Patent
• Language: English
• Published: 29.01.1987
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE

PURPOSE:To considerably reduce the loss of copper or a copper alloy on corrosion in water by treating the surface of the metal with a titanate coupling agent and adding benzotriazole to the water. CONSTITUTION:The surface of copper or a copper alloy is cleaned with acetone, dried and immersed in a soln. of a titanate coupling agent in toluene for about 5min. The solvent is then removed by drying. Thus, an anticorrosive film of the titanate coupling agent is uniformly formed on the surface of the metal. When the metal is immersed in water contg. about 100ppm benzotriazole, the loss on corrosion is only about 0.1mg/cm even after the lapse of 90 days.