WIRE-BONDING METHOD IN SEMICONDUCTOR INTEGRATED CIRCUIT ASSEMBLY AND WIRE-BONDING DEVICE USED THEREFOR

• Main Author: USAMI TAMOTSU
• Format: Patent
• Language: English
• Published: 27.01.1987
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To improve efficiency in wire-bonding work and precision of coupling positions, by bonding the tip-end parts of wires with chip-side electrode pads, bonding the extending parts of wires with base-side electrode pads, and then cutting extra-extended parts of the wires. CONSTITUTION:A pair of rails 1-1 are installed extending through a wire- bonding work station S on a bed B. And freely-movable supporting boards 2, on which a chip-mounting base P is mounted with a semiconductor chip 3 jointed on a package base 4, are set on the rails 1-1. And these supporting boards 2 are moved intermittently in turn so that a chip-mounting base p can be intermittently carried to the wire-bonding work station S, and a wire compression bonder A is arranged on the upper side of the station S. On the central part of a package base 4 in a rectangular-plate shape, the semiconductor chip 3 is connected in smaller rectangular-plate shape, to form the chip-mounting base P.