ION PLATING DEVICE

• Main Authors: SHINOHARA JOSHI, OKABE SHUICHI
• Format: Patent
• Language: English
• Published: 14.07.1987
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To subject a long-sized material to be treated to ion plating of uniform film quality and film thickness at a low cost by moving plural vapor sources which are spaced from each other and are provided on a moving frame in the longitudinal direction of the material to be treated in a vacuum vessel. CONSTITUTION:Electron rays are irradiated from electron guns 1 to the vapor sources 3 to evaporate and ionize raw materials 4 for vapor deposition in the vacuum vessel 7 and the ionized evaporating materials generated by such irradiation are coated on the surface of the material 5 to be treated to which the voltage from a DC power source 2 is impressed. The moving frame 12 which is freely movable along the longitudinal direction of the material 5 to be treated and a cylinder 8 which drives the frame are disposed in the vacuum vessel of the ion plating device constituted in the above-mentioned manner. The plural vapor sources 3, 3 which are spaced from each other along the moving direction are provided on the above-mentioned moving frame 12 in such a manner conditions. Vapor deposition is executed while the above-mentioned vapor sources 3 are moved and the uniform ion plating is made possible with the compact and simple device.