THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED SHEET USING THE SAME

• Main Authors: TADA RITSURO, NARAHARA TOSHIKAZU, WAJIMA MOTOYO, TAWARA KEIKO, TAKAHASHI AKIO, NAGAI AKIRA, KATAGIRI JUNICHI
• Format: Patent
• Language: English
• Published: 14.07.1987
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PURPOSE:To obtain a thermosetting resin which is excellent in heat resistance, flexibility and adhesion to copper foil, low in specific dielectric constant and applicable to a multilayer printed circuit board, etc., by using 1,2-polybutadiene and epoxy-modified polybutadiene. CONSTITUTION:The titled composition essentially consisting of an epoxy- modified polybutadine (A) which is a block polymer of the formula (wherein A is a glycidyl ether type epoxy copolymer and B is an oligomeric polybutadiene having double bonds in side chains and having 0-10 OH groups bonded to the carbon main chain), e.g., epoxy-modified polybutadiene modified with diglycidyl ether bisphenol A, 1,2-polybutadiene (B) and a radical polymerization initiator (C) (e.g., benzoyl peroxide). This composition can be improved in moldability, flexibility and adhesion to copper foil by using both components A and B, and therefore it can be applied to multilayer printed circuit boards, etc.