WIRE BONDING APPARATUS

• Main Authors: OKANO KEITARO, SUEMATSU MUTSUMI
• Format: Patent
• Language: English
• Published: 09.07.1987
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To perform highly accurate bonding at a high speed, by setting the first and second servo gains at the optimum values as the moving operation of a tool and the pressure applying operation of a capillary beforehand, controlling the position when the tool is moved at a high speed, and controlling the compressing force highly accurately when the capillary performs the pressure applying operation. CONSTITUTION:When the first servo gain, whose value is large, is set in a servo system, a tool 1 is lowered at a high speed. When a capillary 1a is contacted with the first bonding point, a speed command pulse, by which the capillary 1a is pushed to the bonding point,is outputted from a control part 11. A specified compressing force is applied. Thus wire bonding is performed. At this time a switching signal SW at an 'H' level is generated from the control part 11. Therefore, a contact point 19b of a switch circuit 19 is closed, and a resistor 18b is inserted in the servo system. As a result, the relatively small servo gain is set in the servo system. Therefore, a motor driving current 9a) with respect to the speed command (b) becomes, e.g., B. As a result, the tool 1 is moved at good accuracy, and the compressing force of the capillary 1a to the bonding point is controlled at the optimum value.