FACE DOWN BONDING DEVICE

• Main Authors: KANEKO FUJIKATSU, KARASAWA MIKIO, YAZAKI NORIHIRO, YAJIMA MASAKAZU, IBE SHINGO
• Format: Patent
• Language: English
• Published: 13.06.1987
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To enable the face down bonding process to be performed with high precision by a method wherein the positional deflection corrected by a rough movement correcting mechanism suing a first tool etc., a chip is held by a second tool, and the positional deflection is limited to the allowance within the range of pattern mathing procedures for high precision alignment. CONSTITUTION:A first tool 9 vacuum-adsorbing a chip 3 on a chip arrayal exclusive jig a first camera 14 detecting an electrode pattern on the main surface of chip 3 vacuum-adsorbed by the first tool 9 and a rough movement correcting mechanism turn-correcting a collet of the first tool 9 referring to the data detected by the first camera 14 are provided. Next, a second tool 10 holding the chip 3 finely aligned by the rough movement correcting mechanism to be shifted on an intermediate pocket, a second camera 15 detecting another electrode pattern on the main surface of chip 3 vacuum-adsorbed by the second tool 10 and a fine movement correcting mechanism turn-correcting another collet of the second tool referring to the data detected by the second camera 15 are also provided. In such a constitution, even if there is any positional deflection exceeding the allowance of pattern matching procedures, the rough and fine movement correcting mechanisms can correct the position of stem accurately with high precision.