ELECTROLESS PALLADIUM PLATING SOLUTION

• Main Authors: NAWAFUNE HIDEMI, TSUJI SEIKI, MIZUMOTO SHOZO, HAGA MASAKI, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 05.06.1987
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To obtain an electroless Pd plating soln. having superior stability and giving a fine film by electroless plating by specifying the concns. of a Pd compound, NH3 or an amine compound, an org. sulfur compond and a hypophosphorous acid compound or a boron hydride compound in an aqueous soln. CONSTITUTION:This electroless Pd plating soln. is an aqueous soln. contg. 0.0001-0.5mol/l Pd compound, 0.001-8mol/l at least one between NH3 and an amine compound, 1-500mg/l org. compound contg. bivalent sulfur and 0.005-1mol/l at least one between a hypophosphorous acid compound and a boron hydride compound. The plating soln. has superior stability and can form a film having fine appearance, satisfactory corrosion resistance and adhesion by electroless plating. When the pH of the plating soln. is adjusted to 5-10, a film free from cracks and having satisfactory solderability is obtd. The rat of deposition of Pd from the plating soln. depends only on the concn, of the metal and the temp. of the soln.