SEMICONDUCTOR DEVICE

• Main Authors: NISHIKAWA AKIO, KANESHIRO TOKUYUKI, OGATA MASAJI
• Format: Patent
• Language: English
• Published: 27.05.1987
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To improve damp-proof characteristics while displaying the effect of alpha-ray shielding by coating the upper sections of a semiconductor element and a lead with a specific polyimide group resin composition. CONSTITUTION:A resin seal type semiconductor device in which the upper sections of a semiconductor element and a lead are coated with a polyimide group resin compo sition, a molecular skeleton thereof has a repeated unit shown in at least formula (In formula, Ar1 and Ar2 represent either group selected from (a) and (b) (wherein X and Y represent a single bond or represent either of O, CH2, C(CH3)2, C(CF3)2, CO, S, SO2, and both may be the same or differ), and Ar3 represents either group selected from (c) and (d) (wherein X and Y have the same definition as said X and Y), and sealed with a resin composition containing inorganic fillers is manufactured. A polyimide coating can be formed in such a manner that varnish acquired by dissolv ing a polymer into a solvent under the state of a precursor is applied onto the semicon ductor element and the lead, heated and treated and changed into polyimide. Soluble polyimide can be applied even by applying varnish, in which polyimide is dissolved, and heating the treating it. A composition, such as an epoxy resin, a phenol resin, a melamine resin, an urea resin, an unsaturated polyester resin, an urethane resin, an silicon resin, a fluoroplastic, etc. is used as the resin composition for sealing containing the inorganic fillers.