EPOXY RESIN

PURPOSE:An epoxy resin excellent in soldering heat resistance and suitable for molding laminated sheets, obtained by reacting a bisphenol-derived epoxy resin with a specified 4,4'-isopropylidenebis(dialkylphenol). CONSTITUTION:100pts.wt. bisphenol A-derived epoxy resin of an equivalent weight &...

Full description

Saved in:
Bibliographic Details
Main Authors HARADA TAIRA, TAKADA TOSHIMASA, ISHIWATA SHUICHI
Format Patent
LanguageEnglish
Published 15.05.1986
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:PURPOSE:An epoxy resin excellent in soldering heat resistance and suitable for molding laminated sheets, obtained by reacting a bisphenol-derived epoxy resin with a specified 4,4'-isopropylidenebis(dialkylphenol). CONSTITUTION:100pts.wt. bisphenol A-derived epoxy resin of an equivalent weight <=500, obtained by reacting bisphenol A with epichlorohydrin, is reacted with 10-60pts.wt. 4,4'-isopropylidenebis(dialkylphenol) in which the alkyl groups are methyl or ethyl groups [e.g., 4,4'-isopropylidenebis(2,6-xylenol)] in the pres ence of a catalyst (e.g., NaOH) at 120-220 deg.C for 3-20hr to obtain an epoxy resin of an epoxy equivalent weight of 230-1,600, represented by the formula (wherein R is methyl or ethyl, and R' is H derived from epichlorohydrin or a lower alkyl derived from beta-methylepichlorohydrin).
Bibliography:Application Number: JP19840218836