INORGANIC FILLER-CONTANING RESIN COMPOSITION

PURPOSE:To provide the titled compsn. having excellent thermal conductivity and an excellent effect of preventing burr formation, by incorporating a specified filler in a thermosetting resin. CONSTITUTION:10-90wt% spherical silica particles obtd. by finely dividing silica sand, tridymite or cristoba...

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Bibliographic Details
Main Authors MURAKAMI SUMIKAZU, KURATA YOSHIAKI, SHINOHARA YASUAKI, ITO MICHIO
Format Patent
LanguageEnglish
Published 03.04.1986
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PURPOSE:To provide the titled compsn. having excellent thermal conductivity and an excellent effect of preventing burr formation, by incorporating a specified filler in a thermosetting resin. CONSTITUTION:10-90wt% spherical silica particles obtd. by finely dividing silica sand, tridymite or cristobalite and passing the resulting particles through high-temperature flame at 2,000 deg.C or above, is mixed with 90-10wt% crushed alumina particles obtd. by crushing sintered or soft-burnt alumina into a powder having a particle size of 177mum or below to obtain a filler. 35-90wt% said filler is blended with a thermosetting resin (e.g. phenolic resin). EFFECT:An inorg. filler-contg. resin compsn. which has low thermal expansibility and is suitable for use as insulating sheet for electronic parts, sealing material and a heat-dissipating sheet can be obtd.
Bibliography:Application Number: JP19840186075