MOUNTING PROCESS

• Main Authors: KASHIMA NORIYASU, SUEMATSU MUTSUMI, YAMAGUCHI MASAYOSHI
• Format: Patent
• Language: English
• Published: 15.02.1986
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To accelerate mounting speed by a method wherein a position slip for automatic location of mounting position is detected by means of setting up position in terms of the position slip value computed within the dispensing process. CONSTITUTION:In a dispense position, a mounting position of electronic part 7 is picked up by a television camera 6 while the binary systemized signals of pick-up image output are checked up with the reference pattern to compute a position slip and then an actual electronic part mounting position is located in terms of the position slip to drip silver paste for bonding the electronic part 7 on this position. The mounting position of electronic part 7 is automatically detected in terms of the position slip of circuit substrate within the dispensing process of pick-up image output to the binary systemized signals while at least two positions preliminarily specified on said circuit substrate are picked up by another television camera 9 mounted on a mount head 8. Then said electronic part 7 picked up from theta table 10 by the mount head 8 may be placed on the mounting position to be mounted on the circuit substrate by the head 8 depressthe part 7 with the compression continuously energized.