WARPAGE MEASURING APPARATUS FOR WIRING BOARD

• Main Authors: FUKAI MAKOTO, OKI SACHIKO
• Format: Patent
• Language: English
• Published: 09.01.1986
• Subjects: MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TESTING

PURPOSE:To accurately record a maximum amount of warpage of a printed-wiring board in an automatic soldering step, by a method wherein a vertically slidable measuring rod which is vertically provided in the center of a gate-shaped frame set on the wiring board is brought into contact with the board to effect measurement. CONSTITUTION:The measuring apparatus comprises a portal frame 2 set on the upper surface of a printed wiring board A, a tubular guide rod 4 vertically provided in the center of the frame 2, a warpage measuring rod 6 which is vertically slidably engaged with the guide rod 4 through small rollers 5 so that the measuring rod 6 contacts the surface a3 of the board A, a recording means 7 such as a pen secured to a part of the rod 6, and a recording material 8 such as fixed form recording paper attached to the frame 2 so that an amount of warpage B is recorded thereon by the recording means 7. With this arrangement, the lower end of the measuring rod 6 is in contact with the surface a3 of the board A by its own weight at all times, and the measuring rod 6 follows any warpage of the board A. Therefore, the recording means 7 is vertically slidable together with the rod 6 in one unit, and a maximum warpage amount in the whole step is recorded on the recording material 8. When this apparatus is set on the board A before the pre-heating step is started, any warpage can be clearly measured in the whole step, so that it is possible to improve the productivity and quality of the product.