MEASURING DEVICE FOR WIRING SUBSTRATE

• Main Authors: FUKAI MAKOTO, OKI SACHIKO
• Format: Patent
• Language: English
• Published: 08.02.1986
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; PRINTED CIRCUITS; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

PURPOSE:To improve the quality of a wiring substrate by a method wherein the lower end of a warpage-measuring rod engaged slidably up and down and a temperature measurer provided at the lower end of the measuring rod are made to contact with the wiring substrate so as to reveal the relationship between the amount of warpage and temperature. CONSTITUTION:Any one of recording, output and reset of the amount of a warp B of a wiring substrate A, temperature and time is selected, with an interval time set for 10sec or 1sec, by a control key 16 of an operating unit 14, and recording is started by inputting a start key. Next, an entire measuring device is set on the top surface a3 of the wiring substrate A before an entry into a preheat process, then processes of preheating, automatic soldering and cooling are executed. Then the lower end 6a of a vertically-slidable measuring rod 6 and a temperature measurer 7 contact with the top surface a3 under their own weight, and the amount of the warpage and the temperature thus detected are inputted as digital signals to a recording device D. By this constitution, a point of problem in the automatic soldering process can be made clear.