PACKAGE FOR MICROWAVE INTEGRATED CIRCUIT AND CONNECTING METHOD THEREOF

PURPOSE:To make grounding inductance small, by directly connecting the grounding conductor of a ceramic substrate, which is attached to a monolithic microwave integrated circuit in a package, to said package. CONSTITUTION:A plurality of input and output terminals 2 are provided on a ceramic substrat...

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Bibliographic Details
Main Authors HORI SHIGEKAZU, TOMITA NAOTAKA
Format Patent
LanguageEnglish
Published 16.12.1986
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To make grounding inductance small, by directly connecting the grounding conductor of a ceramic substrate, which is attached to a monolithic microwave integrated circuit in a package, to said package. CONSTITUTION:A plurality of input and output terminals 2 are provided on a ceramic substrate 1. A grounding conductor 3 is provided on the entire surface of the ceramic substrate 1 with a specified interval being provided with the input and output terminals 2. High frequency input and output terminal parts and a bias terminal parts of an MMIC 6, which is attached on the grounding conductor 3, are connected to the input and output terminals 2 with bonding wires 7. The grounding electrode of the MMIC 6 is directly connected to the grounding conductor 3. A ceramic side wall 4 is provided at the peripheral part on the ceramic substrate 1. A metal cap 5 is provided. The input and output terminals 2 are connected to an outer connecting terminals 10 through metal films 8. Meanwhile, the grounding conductor 3 is connected to the metal cap 5 through a grounding metal film 9. Thus, grounding inductance is made small, and the deterioration of the microwave characteristics can be prevented.
Bibliography:Application Number: JP19850126188