RESIN COMPOSITION

PURPOSE:To provide a resin composition effective to decrease the disconnection defect of a semiconductor element especially having high integration degree when applied to the element as a sealing and surface protection material, by compounding a resin component with a filler consisting of powder of...

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Bibliographic Details
Main Authors KANESHIRO TOKUYUKI, YOKOYAMA TAKASHI
Format Patent
LanguageEnglish
Published 11.12.1986
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PURPOSE:To provide a resin composition effective to decrease the disconnection defect of a semiconductor element especially having high integration degree when applied to the element as a sealing and surface protection material, by compounding a resin component with a filler consisting of powder of a resin having low expansion coefficient. CONSTITUTION:(A) A resin component composed of a thermoplastic resin or thermosetting resin composition, e.g. a resin containing imide ring or a resin component containing epoxy compound as at least a component is compounded with (B) a powdery resin having low expansion coefficient, e.g. (B1) powdery polyimide having low expansion coefficient and obtained by (1) reacting p- phenylenediamine with equimolar amount of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride in N-methyl-2-pyrrolidone solution, (2) pouring the obtained polyamic acid varnish in ice water to produce amic acid powder and, (3) heating the powder under reduced pressure, or (B2) fibrous resin powder obtained by heat-treating a thermoplastic polymer under uniaxial drawing.
Bibliography:Application Number: JP19850122478