MOLD FOR RESIN SEALING

PURPOSE:To prevent the occurrence of blisters and cavities, by setting a gas evacuating hole connected with a pot part, which enables to evacuate completely the air in the pot part. CONSTITUTION:A port part 13 is formed in an upper force 10. The upper end is open to the outside and the side is conne...

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Bibliographic Details
Main Authors MORI HIDEMI, TAKENAKA SHIGEAKI
Format Patent
LanguageEnglish
Published 11.12.1986
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PURPOSE:To prevent the occurrence of blisters and cavities, by setting a gas evacuating hole connected with a pot part, which enables to evacuate completely the air in the pot part. CONSTITUTION:A port part 13 is formed in an upper force 10. The upper end is open to the outside and the side is connected with an one end of a gas evacuating hole 14 the another end of which is open to the outside. As the gas evacuating hole 14 is connected with the pot part 13 of the mold for resin sealing 20, the outflow of a molten resin to the outside of the mold can be completely prevented during air evacuating period. It is thereby possible to evacuate completely the air which tends to mix into the cavity of the mold during resin sealing by making the diameter of the gas evacuating hole 14 large enough and thereby to prevent the occurrence of blisters and cavities in the molding.
Bibliography:Application Number: JP19850123586