PRODUCTION OF FINE PARTICLE OF HEAT-RESISTANT RESIN

• Main Authors: FUJIWARA TERUAKI, TAKEHARA HIDETOSHI, TAKIYAMA KEIICHI
• Format: Patent
• Language: English
• Published: 07.11.1986
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PURPOSE:To obtain the titled resin particles having excellent heat-resistance and solvent-resistance, by carrying out the emulsion polymerization of a monomer composition containing a specific maleimide compound in a hydrophobic organic solvent capable of dissolving the monomer and unable to dissolve the produced polymer, separating the produced polymer from the reaction liquid and drying the polymer. CONSTITUTION:A polymerizable monomer composition containing a maleimide compound of formula (R1 and R2 are H, halogen, 1-15C alkyl, aryl or substituted aryl; R3 is H, 1-15C alkyl, cycloalkyl, aryl or substituted aryl) (e.g. N-phenylmaleimide) is dissolved in a hydrophobic organic solvent (e.g. toluene) capable of dissolving said polymerizable monomer and unable to dissolve the produced polymer. The solution is subjected to emulsion polymerization or suspension polymerization, and the produced polymer particles are separated from the resultant emulsion or suspension and dried to obtain the objective fine resin particles.