THIN FILM FORMING DEVICE

• Main Author: MORI EISAKU
• Format: Patent
• Language: English
• Published: 01.11.1986
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To make uniform heating possible by bending the filaments of a heater to a plane shape and sandwiching a crucible formed to a rectangular parallelepiped shape. CONSTITUTION:A thin film forming device is formed of the crucible 1 which is formed to the rectangular parallelepiped shape and is placed in a high vacuum region, a substrate to be deposited with a thin film and a heating part for heating the crucible 1. The above-mentioned heating part is so formed that the crucible 1 is sandwiched by the filaments 2a, 2b formed by bending the same within the plane parallel with the longitudinal direction of the crucible 1. the crucible 1 is heated by the filaments 2a, 2b and the evaporating material in the crucible 1 is heated and evaporated by which the vapor is injected into a high vacuum and the thin film is stuck to the above-mentioned substrate.